Step 1:Die bonding
The purpose of die bonding is to secure chips onto cups of a holder using silver or insulating adhesive. First, dispensing takes place, applying silver or insulating adhesive at the respective positions on the LED holder.
Step 2:Bonding wire
The two electrodes of the LED chip are soldered to extract the positive and negative poles. This step is typically performed under a microscope to ensure precision.
Step 3:Dot powder
Fluorescent powder needs to be cured onto the LED chip. This is typically achieved through a baking process, where the baking temperature and time depend on the type of fluorescent powder and medium.
Step 4:Glue filling
The process of glue filling involves injecting transparent or colored epoxy resin material into the package to protect the LED chip and wires, and to enhance light extraction efficiency.
Step 5:Appearaance cutting test
The packaged LED products are inspected for appearance and the luminous Angle is tested to ensure that they meet the specifications. For example, check whether the appearance of the LED has defects, such as cracks, bubbles, impurities, and whether the color is uniform, and confirm that the LED pin is correctly formed, no bending or damage
Step 6:Spectroscopy
Electrical and optical performance tests are conducted on the encapsulated LEDs to ensure parameters such as brightness, voltage, wavelength, and other specifications meet requirements.
Step 7:Package
Built-in desiccant, vacuum packaging effectively reduces the LED chip’s contact with oxygen and moisture in the air, thus reducing the possibility of oxidation and corrosion. Helps to extend the life and stability of the LED, and ensures the performance and stability of the packaging material.
