Step 1: Die bonding
The LED chips are bonded to the cups of LED holders using silver or other adhesive. This often involves dotting, where adhesive is applied to specific locations on the LED holders.
Step 1:Die bonding
The LED chips are bonded to the cups of LED holders using silver or other adhesive. This often involves dotting, where adhesive is applied to specific locations on the LED holders.
Step 2:Bonding wire
The two electrodes of the LED chip are welded to extract the positive and negative poles. This is typically done under a microscope to ensure precise welding.
Step 2: Bonding wire
The two electrodes of the LED chip are welded to extract the positive and negative poles. This is typically done under a microscope to ensure precise welding.
Step 3: Mold process
A transparent mold is placed above the chip, and pressure is applied to the mold, molding the encapsulation material onto the LED chip. This process ensures complete encapsulation of the LED chip and uniform coverage of the chip surface by the encapsulation material.
Step 3:Mold process
A transparent mold is placed above the chip, and pressure is applied to the mold, molding the encapsulation material onto the LED chip. This process ensures complete encapsulation of the LED chip and uniform coverage of the chip surface by the encapsulation material.
Step 4: Cutting process
A cutting tool is employed to slice along the contours outlined by the mask, dividing the wafer into individual LED chips. This step is typically conducted on high-precision equipment to ensure accuracy and consistency in the cutting process.
Step 4:Cutting process
A cutting tool is employed to slice along the contours outlined by the mask, dividing the wafer into individual LED chips. This step is typically conducted on high-precision equipment to ensure accuracy and consistency in the cutting process.
Step 5: Spectroscopy
Electrical and optical performance tests are conducted to ensure parameters such as brightness, voltage, wavelength, etc., meet specification requirements.
Step 5:Spectroscopy
Electrical and optical performance tests are conducted to ensure parameters such as brightness, voltage, wavelength, etc., meet specification requirements.
Step 6: Braid process
The braid material is made of plastic or paper material, which is used to fix the LED lamp beads and facilitate the subsequent automated production. Use hot pressing or bonding to fix the lamp bead on the tape to ensure that the chip will not move or fall off during the subsequent production process.
Step 6:Braid process
The braid material is made of plastic or paper material, which is used to fix the LED lamp beads and facilitate the subsequent automated production. Use hot pressing or bonding to fix the lamp bead on the tape to ensure that the chip will not move or fall off during the subsequent production process.
Step 7: Package
Built-in desiccant, vacuum packaging effectively reduces the LED chip’s contact with oxygen and moisture in the air, thus reducing the possibility of oxidation and corrosion. Helps to extend the life and stability of the LED, and ensures the performance and stability of the packaging material.）
Step 7:Package
Built-in desiccant, vacuum packaging effectively reduces the LED chip’s contact with oxygen and moisture in the air, thus reducing the possibility of oxidation and corrosion. Helps to extend the life and stability of the LED, and ensures the performance and stability of the packaging material.）
